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IPC-T-50F Terms and Definition for Interconnecting and Packaging Electronic Circuits 電子電路互連與封裝的定義和術語
IPC-S-100 Standards and Specifications Manual 標準和詳細說明匯編手冊
IPC-E-500 IPC Electronic Document Collection 已出版的IPC標準電子文檔資料合訂本
IPC-TM-650 Test Methods Manual 試驗方法手冊
IPC-ESD-20-20 Association Standard for the Development of an ESD Control Program 靜電釋放控制過程(由靜電釋放協會制定)
IPC/EIA J-STD-001C Requirements for Soldered Electrical & Electronic Assemblies 電氣與電子組裝件錫焊要求
IPC-HDBK-001 Handbook and Guide to Supplement J-STD-001—Includes Amendment 1 J-STD-001輔助手冊及指南及修改說明1
IPC-A-610C Acceptability of Electronic Assemblies 印制板組裝件驗收條件
IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C Comparison IPC-610手冊和指南(包括IPC-A-610B和C的對比)
IPC-EA-100-K Electronic Assembly Reference Set 電子組裝成套手冊，包括：IPC/EIA J-STD-001C，IPC-HDBK-001，IPC-A-610C。
IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies 電纜和引線貼裝的要求和驗收
IPC/EIA J-STD-012 Implementation of Flip Chip and Chip Scale Technology 倒裝芯片及芯片級封裝技術的應用
IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation 芯片直裝技術實施導則
IPC/EIA J-STD-026 Semiconductor Design Standard for Flip Chip Applications 倒裝芯片用半導體設計標準
J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size Configurations FC（倒裝片）和CSP(芯片級封裝)的外形輪廓標準
IPC/EIA J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps 倒裝芯片及芯片級凸塊結構的性能標準
SMC-WP-003 Chip Mounting Technology 芯片貼裝技術
J-STD-013 Implementation of Ball Grid Array and Other High Density Technology 球柵陣列 (BGA)及其它高密度封裝技術的應用
IPC-7095 Design and Assembly Process Implementation for BGAs 球柵陣列的設計與組裝過程的實施
IPC/EIA J-STD-032 Performance Standard for Ball Grid Array Balls BGA球形凸點的標準規范
IT-98000 JPL Chip Scale Packaging Guidelines JPL 發布的CSP導則注：IT (The California Institute of Technology) JPL (The Jet Propulsion Laboratory)
IT-98080 JPL Ball Grid Array Packaging Guidelines JPL 發布的BGA封裝導則
IT-98093 ITRI Chip Carrier, Phase 1 Report ITRI 關于芯片載體的報告 ITRI (The Interconnect Technology Research Institute)
IPC-MC-790 Guidelines for Multichip Module Technology Utilization 多芯片組件技術應用導則
IPC-M-108 Cleaning Guides and Handbook Manual 清洗導則和手冊
IPC-TP-1113 Circuit Board Ionic Cleanliness Measurement: What Does It Tell Us? 電路板離子潔凈度測量：它告訴我們什么？
IPC-CH-65A Guidelines for Cleaning of Printed Boards & Assemblies 印制板及組裝件清洗導則
IPC-SC-60A Post Solder Solvent Cleaning Handbook 錫焊后溶劑清洗手冊
IPC-SA-61 Post Solder Semi-aqueous Cleaning Handbook 錫焊后半水溶劑清洗手冊
IPC-AC-62A Aqueous Post Solder Cleaning Handbook 錫焊后水溶液清洗手冊
IPC-TR-476A Electrochemical Migration: Electrically Induced Failures in Printed Circuit Assemblies 電化學遷移：印制電路組件的電氣誘發故障
IPC-TR-580 Cleaning and Cleanliness Test Program Phase 1 Test Results 清洗及清潔度試驗計劃1階段試驗結果
IPC-TR-582 Cleaning and Cleanliness Test Program for: Phase 3 --Low Solids, Fluxes and Pastes Processed in Ambient Air IPC第3階段非清洗助焊劑研究
IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing 深入離子潔凈度測試
IPC-9201 Surface Insulation Resistance Handbook 表面絕緣電阻手冊
IPC-TP-104K Cleaning & Cleanliness Test Program, Phase 3 Water Soluble Fluxes, Part 1 & Part 2第3階段水溶性助焊劑清洗，第一和第二部分
IPC-M-109 Component Handling Manual 元件處理手冊
IPC/JEDEC J-STD-020B Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices 非密封固態表面貼裝器件濕度/再流焊敏感度分類
IPC/JEDEC J-STD-033A Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices 對濕度、再流焊敏感表面貼裝器件的處置、包裝、發運和使用
IPC/JEDEC J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components 非氣密封裝電子元件用聲波顯微鏡
IPC-9500-K Set of four documents 9501-9504 9501至9504手冊合訂本
IPC-DRM-18F Component Identification Desk Reference Manual 零件分類標識手冊
IPC-DRM-SMT-C Surface Mount Solder Joint Evaluation Desk Reference Manual 接插件焊接點評價手冊
IPC-DRM-40E Through-Hole Solder Joint Evaluation Desk Reference Manual 接插件焊接點評價手冊
IPC-DRM-56 Wire Preparation & Crimping Desk Reference Manual 導線和端子預成形參考手冊
IPC-DRM-53 Introduction to Electronics Assembly Desk Reference Manual 電子組裝基礎介紹手冊
IPC-M-103 Standards for Surface Mount Assemblies Manual 所有SMT標準合訂本
IPC-M-104 Standards for Printed Board Assembly Manual 10種常用印制板組裝標準合訂本
IPC-TA-722 Technology Assessment of Soldering 錫焊技術精選手冊
IPC-TA-723 Technology Assessment Handbook on Surface Mounting 表面安裝技術精選手冊
IPC-TA-724 Technology Assessment Series on Clean Rooms 清潔室技術精選系列
IPC-SM-780 Component Packaging and Interconnecting with Emphasis on Surface Mounting 以表面安裝為主的元件封裝及互連導則
IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments 表面安裝焊接件加速可靠性試驗導則
IPC-PD-335 Electronic Packaging Handbook 電子封裝手冊
IPC-7525 Stencil Design Guidelines 網版設計導則
IPC-TR-581 IPC Phase III Controlled Atmosphere Soldering Study IPC第3階段受控氣氛焊接研究
IPC-MI-660 Incoming Inspection of Raw Materials Manual 原材料接收檢驗手冊
IPC/EIA J-STD-004 Requirements for Soldering Fluxes-Includes Amendment 1 錫焊焊劑要求（包括修改單1）
IPC/EIA J-STD-005 Requirements for Soldering Pastes-Includes Amendment 1 焊膏技術要求（包括修改單1）
IPC-HDBK-005 Guide to Solder Paste Assessment 焊膏性能評價手冊
IPC/EIA J-STD-006A Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders 電子設備用電子級錫焊合金、帶焊劑及不帶劑整體焊料技術要求
IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives 表面安裝用介電粘接劑通用要求
IPC-CA-821 General Requirements for Thermally Conductive Adhesives 導熱膠粘劑通用要求
IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives 表面貼裝導電膠使用指南
IPC-3408 General Requirements for Anisotropically Conductive Adhesives Films 各向異性導電膠膜的一般要求
IPC-CC-830B Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies 印制板組裝電氣絕緣性能和質量手冊
IPC-HDBK-830 Guideline for Design, Selection and Application of Conformal Coatings 敷形涂層的設計，選擇和應用手冊
IPC-SM-840C Qualification and Performance of Permanent Solder Mask - Includes Amendment 1 永久性阻焊劑的鑒定及性能(包括修改單1)
IPC-HDBK-840 Guide to Solder Paste Assessment 焊膏性能評價手冊
IPC-TP-1114 The Layman’s Guide to Qualifying a Process to J-STD-001 基于J-STD-001組裝工藝雷氏選擇法
IPC-TR-467 Supporting Data & Numerical Examples for J-STD-001 (Control of Fluxes) J-STD-001(焊劑控制)的支持數據及數字實例
IPC-AJ-820 Assembly & Joining Handbook 裝聯手冊
IPC-7530 Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes 大規模焊接(回流焊與波峰焊)過程溫度曲線指南
IPC-9701 Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments 表面安裝錫焊件性能試驗方法與鑒定要求
IPC-TP-1090 The Layman’s Guide to Qualifying New Fluxes 新型助焊劑雷氏選擇法
IPC-TP-1115 Selection and Implementation Strategy for a Low-Residue No-Clean Process 低殘留不清洗工藝的選擇和實施
IPC-S-816 SMT Process Guideline & Checklist 表面安裝技術過程導則及檢核表
IPC-TR-460A Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards 印制板波峰焊故障排除檢查表
IPC-CM-770D Component Mounting Guidelines for Printed Boards 印制板元件安裝導則
IPC-7912 Calculation of DPMO & Manufacturing Indices for Printed Board Assemblies 印制板和電子組裝件每百萬件缺陷數(DPMO)和制造指數的計算
IPC-9261 In-Process DPMO and Estimated Yield for PWAs 印制板組裝過程中每百萬件缺陷數(DPMO)及合格率估計
IPC-9501 PWB Assembly Process Simulation for Evaluation of Electronic Components 電子元件的印制板組裝過程模擬評價
IPC-9502 PWB Assembly Soldering Process Guideline for Electronic Components 電子元件的印制板組裝焊接過導則
IPC-9503 Moisture Sensitivity Classification for Non-IC Components 非集成電路元件的濕度敏感度分級
IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components) 非集成電路元件的組裝過程模擬評價（非集成電路元件預處理）
IPC-9850-K Surface Mount Placement Equipment Characterization-KIT 表面貼裝設備性能檢測方法的描述（附Gerber格式CD盤）
IPC-9850-TM-KW, IPC-9850-TM-K Test Materials Kit for Surface Mount Placement Equipment Standardization 表面貼裝設備性能測試用的標準工具包 • 4 IPC-9850 Placement Accuracy Verification Panels • 1 IPC-9850 CMM Measurement Verification Panels • 150 IPC-9850 QFP-100 Glass Components • 130 IPC-9850 QFP-208 Glass Components • 150 IPC-9850 BGA-228 Glass Components • NIST Traceable Measurement Certificate • Custom Storage Case
IPC-7711/21 7711 & 7721 Package 合訂本
IPC-7711 Rework of Electronic Assemblies 電子組裝件的返工
IPC-7721 Repair and Modification of Printed Boards and Electronic Assemblies 印制板和電子組裝件的修復與修正
IPC/EIA J-STD-002B Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires 元件引線、端子、焊片、接線柱及導線可焊性試驗
IPC/EIA J-STD-003 Solderability Tests for Printed Boards 印制板可焊性試驗
IPC-TR-461 Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards 印制板波峰焊故障排除檢查表
IPC-TR-462 Solderability Evaluation of Printed Boards with Protective Coatings Over Long-term Storage 帶保護性涂層印制板長期貯存的可焊性評價
IPC-TR-464 Accelerated Aging for Solderability Evaluations 可焊性加速老化評價(附修訂)
IPC-TR-465-1 Round Robin Test on Steam Ager Temperature Control Stability 蒸汽老化器溫度控制穩定性聯合試驗
IPC-TR-465-2 The Effect of Steam Aging Time and Temperature on Solderability Test Results 蒸汽老化時間與溫度對可焊性試驗結果的影響
IPC-TR-465-3 Evaluation of Steam Aging on Alternative Finishes, Phase IIA 替代涂覆層的蒸汽老化評價
IPC-TR-466 Technical Report: Wetting Balance Standard Weight Comparison Test 技術報告: 潤濕天平稱重標準對比測試
SMC-WP-001 Soldering Capability White Paper Report 可焊性工藝導論
SMC-WP-005 PCB Surface Finishes 印制電路板表面清洗
更多IPC標準信息，請訪問http://www.ipc.org
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